OCP-IP & CircuitSutra Provides Virtual Platform Leveraging Advanced OCP SystemC TLM Modeling Kit (Aug, 2010)

CircuitSutra joins Cadence System realization alliance as a founding member (July, 2010)

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SystemC based SoC Modeling Services

SystemC has the potential to change how the chips are designed and how the embedded software is developed. The SystemC / TLM based design and verification flow can raise the abstraction of chip design and provide the long awaited productivity gains to tackle the ever growing complexity in chip design process.

With strong focus on SoC modeling, CircuitSutra is all set to play an important role in the future of Semiconductor industry.

Virtual Platform for embedded software development

• Allows the embedded software development without FPGA board
• Chip design and eSW can proceed in parallel. Reduces TTM for SoC
• Advanced  tools are being available for better eSW development and debugging

Synthesizable models for High Level Synthesis (HLS)

• High level design using Synthesizable SystemC Subset
• Designer can focus on implementing the functionality
• HLS tools can generate the most optimum RTL code for specific constraints
• Power, Area, performance constraints
• Process node
• Process node
• Raises the abstraction of chip design
• SystemC might replace verilog as the language of chip design

SystemC models for RTL verification or HW/SW coverification

Bus specific TLM kit by extending OSCI TLM2.0

SystemC-AMS: Virtual models of analog & mixed signal blocks

Modeling Standards supported

CircuitSutra is a strong supporter of STANDARDS. The models that we create can be integrated into any ESL / EDA environment without requiring any change in the models, this is a necessary condition for SystemC to become the language of choice for design entry. CircuitSutra is highly commited to enable the widespread adoption of SoC modeling standards in the industry.

• SystemC IEEE 1666
  
• OSCI TLM2.0
• STARC TL Guidelines V2
• OSCI Synthesizable SystemC subset
  
• OSCI SystemC-AMS
• OSCI CCI (participating in the working group)
  
• OCP-IP TLM Kit